1. 2. 3. material content data sheet sales product name sak-xc164cs-32f40f bb-a issued 29. august 2013 ma# MA000971540 package pg-tqfp-100-5 weight* 699.69 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 33.010 4.72 4.72 47177 47177 leadframe non noble metal magnesium 7439-95-4 0.282 0.04 403 inorganic material silicon 7440-21-3 1.222 0.17 1746 non noble metal nickel 7440-02-0 5.638 0.81 8058 non noble metal copper 7440-50-8 180.785 25.84 26.86 258378 268585 wire noble metal gold 7440-57-5 2.953 0.42 0.42 4221 4221 encapsulation organic material carbon black 1333-86-4 2.300 0.33 3288 plastics epoxy resin - 62.107 8.88 88763 inorganic material silicondioxide 60676-86-0 395.643 56.54 65.75 565453 657504 leadfinish non noble metal tin 7440-31-5 6.201 0.89 0.89 8862 8862 plating noble metal silver 7440-22-4 3.477 0.50 0.50 4970 4970 glue plastics epoxy resin - 1.215 0.17 1736 noble metal silver 7440-22-4 4.859 0.69 0.86 6945 8681 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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